10 Sep

Wafer Probing with Automatic Test Equipment

The electrical test utilized by probing is almost certainly not as extensive as production electrical testing at post-assembly device level. Nonetheless, probing needs to be in a position to check if the dice on a wafer are functional and meeting critical electrical parameters. Good probing systems can map the failing dice on a wafer, relating the positioning associated with die from the wafer to the failure modes observed.

Examples of ATE (Automated Test Equipment) Interfaces for Probe Systems

Automatic Test Equipment (ATE) use is an expensive process, so it’s usually dispensed with for mature and stable items that are able to meet yield expectations despite blind assembly.

Laser diode wafer trimming is the method of adjusting the resistance worth of a laser diode wafer from the die, and it is attained by burning ‘notches’ in the laser diode wafer structure using a laser beam. Cutting across a laser diode with a laser beam reduces the laser diode’s effective cross-section, enhancing the resistance value. laser diode trimming is a fine-tuning step done to optimize the parametric characteristics of a tool.

No matter what application – device characterization, modeling, process development, design de-bug or IC failure analysis, Cascade 200 mm wafer probing systems have the precision and versatility needed for the essential advanced semiconductor processes and aggressively scaled devices.

Laser diode trimming is usually done in conjunction with wafer probing, wherein an electrical parameter measured during probing is defined within the acceptable range by adjusting the resistance value of the appropriate laser diode.